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Intel debuted its 3D QLC NAND flash memory on new SSD DC series 2.5-inch U.2 PCIe drives. The 1 TB variant offers 150,000 IOPS 4K random reads, and up to 220,000 IOPS random writes while the 2 TB variant has 4K random reads/writes numbers of 220,000 IOPS. The 1 TB and 2 TB variants both sequentially read and write at up to 1800 MB/s. Performance numbers differ by variant, and the 512 GB drive is the slowest, sequentially reading at speeds of up to 1500 MB/s, with up to 1000 MB/s sequential writes up to 90,000 4K random reads, and up to 220,000 IOPS 4K random writes. It's also interesting to note here that the controller is cushioned by a DRAM cache (something PCIe x2 drives tend to lack, to keep costs down). Intel's pricing puts these drives close to competing drives with PCIe x2 interface, but offering higher transfer rates thanks to the wider bus. The prices are the biggest dividend of QLC: the 512 GB variant goes for USD $99.99, the 1 TB variant at $199.99, and the 2 TB variant for $399.99.īuilt in the M.2-2280 form-factor, the SSD 660p series drives feature PCI-Express 3.0 x4 interface. The 660p series comes in three variants based on size - 512 GB, 1 TB, and 2 TB. The drives use over 10% of the QLC NAND flash area as SLC cache. This chip is a derivative of the popular SMI2262EN, built on a newer process, with support for QLC NAND flash, compacted to have a smaller PCB footprint, and is driven by a custom firmware by Intel. This memory is mated with a SIlicon Motion SMI 2263 controller. At the heart of these drives is the new 64-layer 3D QLC (quadruple level cell, or 4 bits per cell) NAND flash memory by IMFlash Technology (an Intel and Micron joint-venture). Intel Tuesday introduced the new SSD 660p series M.2 NVMe solid state drives. The board is expected to be priced around $500. RGB LED diffusers dot the rear I/O shroud, the chipset heatsink, and the reverse side of the PCB. You get 10 USB 3.1 ports on the rear panel (including a type-C port), and four USB 3.1 ports via front-panel headers). Connectivity includes MSI's highest-grade onboard audio solution combining an ALC1220 with a headphones amplifier, and audio-grade capacitors and two 1 GbE interfaces driven by Intel i219-V controllers (10 GbE is a notable absentee) and 802.11ac + BT 5.0 WLAN. Storage connectivity includes 7 M.2-NVMe slots (3 onboard, 4 via the included M.2-Xpander Aero accessory) and eight SATA 6 Gbps ports. It ends up looking like a graphics card in doing so.Įxpansion includes eight DDR4 DIMM slots supporting up to 2048 GB of DDR4 ECC memory four PCI-Express 3.0 x16 slots (full-time x16/x8/x16/x4), and an x1.
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You get 4 more M.2-2280 slots over the new M.2-Xpander Aero, which is a PCI-Express 3.0 x16 riser card that converts the slot to four M.2-2280 slots with x4 wiring, ventilating them with a 100 mm fan. The huge chipset heatsink cools not just the X399 chipset, but also three M.2-NVMe slots (two M.2-22110 and one M.2-2280). Heat drawn from the CPU VRM MOSFETS is dissipated not just by a large heatsink that spans almost the entire width of the board, but also a secondary heatsink cooling the SoC phases, via a heat-pipe. The board draws power from a combination of 24-pin ATX, two 8-pin EPS, and an optional 4-pin Molex. The highlight of this board is its gargantuan 19-phase CPU VRM that's optimized for overclocking event the 32-core Threadripper 2990WX. Although built in the ATX form-factor, this board is recommended only for EATX-capable cases. The company showed off this board at the 2018 Computex, held this June.
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2012 and earlier or the newer 2018 model all have socketed memory and can be upgraded it is only the 2014 model that does not.MSI today announced the MEG X399 Creation, its flagship socket TR4 motherboard, with out of the box support for 2nd generation AMD Ryzen Threadripper 2000 processors. Any DIY attempt would merely destroy either the logic board or chips or both. However newer logic boards, chips and manufacturing techniques mean that these days an ordinary soldering iron is totally useless for this purpose and you need tools equivalent to those used originally to build the logic boards, as such it is not possible unless you are a major manufacturer and they have no interest in doing this. ) I remember some enterprising people doing this to upgrade the original Macintosh 128KB to a 'Fat Mac' with 512KB, I even had this done to my own one back in 1985. In theory one could unsolder the existing chips and solder new bigger capacity ones, this indeed did use to be commonly done in the olden days. This leaves the only option as being to sell it and buy a better model. For the Mac mini 2014 the memory is as you state soldered to the logic board, as such it is generally regarded as impossible to upgrade the memory.